How to reasonably carry out PCB layout design and PCB design

The PCB board is based on the circuit schematic diagram to realize the functions required by the circuit designer. PCB layout design includes layout design, which needs to consider various factors such as the layout of external connections, the optimized layout of internal electronic components, the optimized layout of metal connections and through holes, electromagnetic protection, and heat dissipation. If heat dissipation is not good, the reliability of electronic equipment will decrease, and even electronic equipment will fail due to overheating of the device. Therefore, it is very important to conduct heat dissipation design processing on the circuit board.

Generally, the direct cause of the temperature rise of the printed board is due to the existence of power consumption devices in the circuit, and the electronic devices all have power consumption to varying degrees, and the heating intensity varies with the size of the power consumption. There are two phenomena of temperature rise in printed boards, one is local temperature rise or large area temperature rise, and the other is short-term temperature rise or long-term temperature rise.

Ways to improve the temperature rise of PCB printed boards need to be considered in many aspects because these factors are often interrelated and dependent on a product and system. Most of the factors should be analyzed according to the actual situation, only for a specific. The actual situation can calculate or estimate the parameters such as temperature rise and power consumption more correctly.

So when PCB design heat dissipation, Generally from the following aspects to solve the PCB heat dissipation method to optimize its design.

1. High heat-generating device plus radiator, heat conduction plate (tube)

When a small number of components in the PCB generate a large amount of heat (less than 3), a radiator or heat pipe can be added to the heating component. When the temperature cannot be lowered, a radiator with a fan can be used to enhance the heat dissipation effect. When the number of heating devices is large (more than 3), a large heat sink (tube) can be used, which is a special radiator customized according to the position and height of the heating device on the PCB or a large flat radiator. Cut out different component height positions. The heat dissipation cover is integrally buckled on the surface of the component, and it is in contact with each component to dissipate heat. However, the heat dissipation effect is not good due to the poor consistency of height during assembly and welding of components. In recent years, a soft thermal phase-change thermal pad will be added to the surface of some high-heat components to improve the heat dissipation effect.